About this 3D model

This is a forced cooling enclosure i created to suit the Gen 6 electronics. The fan duct is glued onto the main cover as im too lazy to change it to a snap on, plus glued could have several advantages. The cover snaps onto the base and a 40mm fan is attached to the fan duct. This creates a wider higher pressure flow of air for cooling in the important places. It provides good forced cooling keeping the board cool.