About this 3D model

More details on the build available here. A project enclosure with integrated strain-relief and mount points for attaching to 2020 aluminum extrusion. Designed to hold a 'medium' solderless breadboard and intended for sensing. As a result of the latter, it does not feature much in the way of air exchange for heat management. I specifically sized the interior to accommodate an Arduino Nano form factor MCU with USB connected. Category: Electronics